Packages for integrated circuits and methods of packaging integrated circuits
US9786838B2 · kind B2 · utility
1Cited by
1References
25Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 11, 2016 |
| Grant date | Oct 10, 2017 |
| Priority date | — |
| Expiry date | Oct 11, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit package including an integrated circuit die including a first side and a second side opposite the first side, the first side including at least one magnetoresistive device formed thereon. The integrated circuit package also may include a first magnetic shield disposed on or adjacent the first side of the integrated circuit die, wherein the first magnetic shield is formed of a composite material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.