Semiconductor memory device having a heat insulating mechanism
US9788463B2 · kind B2 · utility
4Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 1, 2015 |
| Grant date | Oct 10, 2017 |
| Priority date | — |
| Expiry date | Feb 28, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C5/04
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor memory device includes a semiconductor memory unit, a memory controller, a cover unit having a first portion covering the semiconductor memory unit and a second portion covering the memory controller, a first heat conduction member disposed between the semiconductor memory unit and the first portion of the cover unit, and a second heat conduction member disposed between the memory controller and the second portion of the cover. The cover unit has a gap formed between the first and second portions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.