Method of joining metal-ceramic substrates to metal bodies
US9790130B2 · kind B2 · utility
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16References
21Claims
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Key dates
| Filing date | May 29, 2012 |
| Grant date | Oct 17, 2017 |
| Priority date | — |
| Expiry date | Aug 23, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/09701
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of joining a metal-ceramic substrate having metallization on at least one side to a metal body by using metal alloy is disclosed. The metal body has a thickness of less than 1.0 mm and the metal alloy contains aluminum and has a liquidus temperature of greater than 450° C. The resulting metal-ceramic module provides a strong bond between the metal body and the ceramic substrate. The resulting module is useful as a circuit carrier in electronic appliances, with the metal body preferably functioning as a cooling body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.