Method for fabricating an embedded pattern using a transfer-based imprinting
US9791601B2 · kind B2 · utility
1Cited by
6References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 28, 2014 |
| Grant date | Oct 17, 2017 |
| Priority date | — |
| Expiry date | Mar 30, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1041
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In a method for fabricating an embedded pattern using a transfer-based imprinting, an adhesive layer is formed on a substrate. The adhesive layer has a photo curable resin. A stamp having a protruded pattern is prepared. A thin-film layer is formed on an outer surface of the protruded pattern of the stamp. The stamp having the thin-film layer contact with the adhesive layer is pressed to selectively transfer the thin-film layer of the protruded pattern to the adhesive layer. Ultraviolet rays (UV) are irradiated to cure the adhesive layer. The stamp is removed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.