Distributed computing with phase change material thermal management
US9792961B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 21, 2014 |
| Grant date | Oct 17, 2017 |
| Priority date | — |
| Expiry date | Apr 29, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C13/0061
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Various apparatus and methods using phase change materials are disclosed. In one aspect, a method of operating a computing device that has a first semiconductor chip with a first phase change material and a second semiconductor chip with a second phase change material is provided. The method includes determining if the first semiconductor chip phase change material has available thermal capacity. If the first semiconductor chip phase change material has available thermal capacity then the first semiconductor chip is instructed to operate in sprint mode. The first semiconductor chip is instructed to perform a first computing task while in sprint mode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.