Wafer holder and temperature conditioning arrangement and method of manufacturing a wafer
US9793144B2 · kind B2 · utility
0Cited by
7References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 30, 2011 |
| Grant date | Oct 17, 2017 |
| Priority date | — |
| Expiry date | Jul 24, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67115
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer holder and temperature controlling arrangement has a metal circular wafer carrier plate, which covers a heater compartment. In the heater compartment a multitude of heater lamp tubes is arranged, which directly acts upon the circular wafer carrier plate. Latter is drivingly rotatable about the central axis. A wafer is held on the circular wafer carrier plate by means of a weight-ring residing upon the periphery of a wafer deposited on the wafer carrier plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.