Under bump metallurgy (UBM) and methods of forming same
US9793231B2 · kind B2 · utility
12Cited by
13References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2015 |
| Grant date | Oct 17, 2017 |
| Priority date | — |
| Expiry date | Jun 30, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/2064
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device package includes a die, fan-out redistribution layers (RDLs) over the die, and an under bump metallurgy (UBM) over the fan-out RDLs. The UBM comprises a conductive pad portion and a trench encircling the conductive pad portion. The device package further includes a connector disposed on the conductive pad portion of the UBM. The fan-out RDLs electrically connect the connector and the UBM to the die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.