Package board, method for manufacturing the same and package on package having the same
US9793250B2 · kind B2 · utility
2Cited by
2References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 21, 2015 |
| Grant date | Oct 17, 2017 |
| Priority date | — |
| Expiry date | Dec 1, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4697
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There are provided a package board, a method for manufacturing the same, and a package on package having the same. The package board according to an exemplary embodiment of the present disclosure includes a first insulating layer formed with a cavity having a penetrating shape; and a first connection pad formed to penetrate through the first insulating layer and formed at one side of the cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.