Radiometric test and configuration of an infrared focal plane array at wafer probe
US9797942B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 27, 2015 |
| Grant date | Oct 24, 2017 |
| Priority date | — |
| Expiry date | Apr 15, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/318511
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
FPAs on a wafer can be tested prior to dicing the wafer into individual dies. A focal plane array (FPA) can comprise an array of photodetectors, such as microbolometers, on a semiconductor substrate or die. FPAs can be manufactured on a wafer to make multiple FPAs on a single wafer that can be later diced or divided into individual FPAs. Prior to dicing the wafer, the FPAs can be tested electrically and radiometrically in bulk to characterize individual FPAs, to identify bad pixels, to identify bad chips, to calibrate individual FPAs, and the like. These test results can be used to determine acceptable FPAs and can be used to provide initial settings for imaging systems with the tested and integrated FPA.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.