Method for forming a case for an electronic device and manufactured case structure for electronic device
US9799585B2 · kind B2 · utility
1Cited by
2References
6Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Apr 9, 2014 |
| Grant date | Oct 24, 2017 |
| Priority date | — |
| Expiry date | Aug 21, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/14
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for forming a case for an electronic device and a manufactured case structure for an electronic device are provided. The method for forming a case for an electronic device comprises the following steps. Provide a plastic material. Provide a plurality of PCM microcapsules. Mix the plastic material and the plurality of PCM microcapsules so as to form a housing material. Form a case from the housing material by injection molding. The manufactured case structure for an electronic device comprises a plastic layer and a plurality of PCM microcapsules. The plurality of PCM microcapsules are dispersed in the plastic layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.