Mixed UBM and mixed pitch on a single die
US9799618B1 · kind B1 · utility
8Cited by
9References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 12, 2016 |
| Grant date | Oct 24, 2017 |
| Priority date | — |
| Expiry date | Oct 12, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/07025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments are directed to a method of forming a semiconductor chip package and resulting structures having a mixed under-bump metallization (UBM) size and pitch on a single die. A first set of UBMs having a first total plateable surface area is formed on a first region of a die. A second set of UBMs having an equal total plateable surface area is formed on a second region of the die. A solder bump having a calculated solder height is applied to a plateable surface of each UBM. The solder height is calculated such that a volume of solder in the first region is equal to a volume of solder in the second region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.