Semiconductor package with lid having lid conductive structure
US9799637B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 13, 2016 |
| Grant date | Oct 24, 2017 |
| Priority date | — |
| Expiry date | Oct 13, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/164
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to a semiconductor package with a lid that includes a lid conductive structure. The semiconductor package includes a substrate with a top surface, a lid over the top surface of the substrate, and at least one substrate-mounted component mounted on the top surface of the substrate. Herein, a cavity is defined within the lid and over the top surface of the substrate. The substrate includes a metal pad over the top surface of the substrate. The lid includes a lid conductive structure, a lid body, and a perimeter wall that extends from a perimeter of the lid body toward the top surface of the substrate. The lid conductive structure includes a body conductor that extends through a portion of the lid body and a wall conductor that is coupled to the body conductor, extends through the perimeter wall, and is electronically coupled to the metal pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.