Method for producing an optoelectronic semiconductor chip

US9799801B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Christian Schmid · San Diego, US
• Julia Grosser · Regensburg, DE
• Richard Floeter · Tegernheim, DE
• Markus Broell · Cork, IE

Key dates

• Filing date: May 14, 2014
• Grant date: Oct 24, 2017
• Expiry date: May 14, 2034

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/036

Abstract

A method for producing an optoelectronic semiconductor chip comprises the following steps: providing a substrate, depositing a sacrificial layer, depositing a functional semiconductor layer sequence, laterally patterning the functional semiconductor layer sequence, and oxidizing the sacrificial layer in a wet thermal oxidation process.