LED module with multi-layer resist
US9799803B2 · kind B2 · utility
1Cited by
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11Claims
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Key dates
| Filing date | Jul 29, 2016 |
| Grant date | Oct 24, 2017 |
| Priority date | — |
| Expiry date | Jul 29, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
Abstract
A light emitting diode (LED) module including: a substrate; a resist including a plurality of layers, above the substrate; and an LED element mounted above the resist via an adhesive. The adhesive includes an addition-reaction type silicone resin. In the resist, a higher positioned layer of the plurality of layers is lower in at least one of sulfur content, phosphorus content, and nitrogen content than a lower positioned layer of the plurality of layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.