Patent · US Active

Rosin-free thermosetting flux formulations

US9802275B2 · kind B2 · utility

2Cited by

3References

28Claims

0Family size

Inventors

Morgana De Avila Ribas · Bengaluru, IN
Rahul Raut · Edison, US
Traian Cornel Cucu · South Plainfield, US
Shu Tai Yong · Singapore, SG
Siuli Sarkar · South Plainfield, US
Ramakrishna Hosur Katagiriyappa · Bengaluru, IN

Key dates

Filing date	Dec 31, 2014
Grant date	Oct 31, 2017
Priority date	—
Expiry date	Dec 31, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/032
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

Rosin-free thermosetting flux formulations for enhancing the mechanical reliability of solder joints. In accordance with one or more aspects, a solder paste as shown and described herein imparts improved or enhanced solder joint properties relating to at least one of drop shock, thermal cycling, thermal shock, shear strength, flexural strength performance, and/or other thermal-mechanical performance attributes.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.