Wafer-level hybrid compound lens and method for fabricating same
US9804367B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 4, 2015 |
| Grant date | Oct 31, 2017 |
| Priority date | — |
| Expiry date | Dec 23, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B1/041
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A hybrid compound lens includes a substrate lens and a resin lens. The substrate lens has a non-planar substrate surface surrounded by a flange having a flange surface bordering the non-planar substrate surface and forming an obtuse angle therewith. The resin lens has a non-planar resin surface adjoining the substrate lens along the non-planar substrate surface. A lens wafer includes a substrate wafer and resin lenses. The substrate wafer has a top surface having non-planar surface features each bordered by a planar region of the top surface and forming an obtuse angle therewith. Each resin lens has a non-planar resin surface adjoining the substrate wafer along a non-planar surface feature. A method for fabricating a wafer-level hybrid compound lens includes depositing a resin portion on a non-planar feature of a side of a substrate. The method also includes forming the resin portion into a lens on the non-planar feature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.