Substrate conveyance method, and substrate conveyance device
US9805962B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 5, 2013 |
| Grant date | Oct 31, 2017 |
| Priority date | — |
| Expiry date | Dec 3, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6776
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The purpose of the present invention is to accurately deal with a variety of processing conditions and variations thereof, and to improve total throughput by efficiently operating a conveyance arm device in accordance with the processing conditions, even during cleaning. When a first wafer is loaded on a load-lock chamber, a conveyance-sequence category for operating each of a number of steps for a conveyance arm device capable of operating during cleaning is selected in accordance with processing conditions of the wafer, and a plurality of operation patterns are selected, combined and scheduled. The conveyance arm device is controlled in accordance with the scheduled conveyance sequence to control substrate conveyance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.