Patent · US Active

System and method for multi-location zapping

US9805964B2 · kind B2 · utility

1Cited by

6References

13Claims

0Family size

Assignee

Applied Materials Israel Ltd. · IL

Inventors

Tuvia Biber · Rishon LeZion, IL
Efim Kerner · Rehovot, IL
Efraim Siman Tov · Rehovot, IL

Key dates

Filing date	Mar 14, 2016
Grant date	Oct 31, 2017
Priority date	—
Expiry date	Mar 14, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH01L22/14
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A system for zapping a wafer, the system may include a pulse generation unit that is configured to generate (a) first zapping pulses for causing a breakdown in a first location of a backside insulating layer of a wafer, and (b) second zapping pulses for causing a breakdown in a second location of the backside insulating layer of the wafer; a first conductive interface that is configured to convey the first zapping pulses to the first location, while contacting the first location; a second conductive interface that is configured to convey the second zapping pulses to the second location, while contacting the second location; and wherein the first location differs from the second location.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.