Patent · US Active

Non-uniform substrate stackup

US9806011B2 · kind B2 · utility

5Cited by

3References

11Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Zhichao Zhang · Chandler, US
Tao Wu · Chandler, US
Zhiguo Qian · Chandler, US
Kemal Aygun · Tempe, US

Key dates

Filing date	Dec 18, 2015
Grant date	Oct 31, 2017
Priority date	—
Expiry date	Dec 18, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/09736
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Some embodiments described herein include apparatuses and methods of forming such apparatuses. One such embodiment may include a routing arrangement having pads to be coupled to a semiconductor die, with a first trace coupled to a first pad among the pads, and a second trace coupled to a second pad among the pads. The first and second traces may have different thicknesses. Other embodiments including additional apparatuses and methods are described.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.