Multi-stack package-on-package structures
US9806059B1 · kind B1 · utility
8Cited by
10References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 12, 2016 |
| Grant date | Oct 31, 2017 |
| Priority date | — |
| Expiry date | May 12, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/37001
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Multi-stack package-on-package structures are disclosed. In a method, a first stacked semiconductor device is formed on a first carrier wafer. The first stacked semiconductor device is singulated. The first stacked semiconductor device is adhered to a second carrier wafer. A second semiconductor device is attached on the first stacked semiconductor device. The second semiconductor device and the first stacked semiconductor device are encapsulated. Electrical connections are formed on and electrically coupled to the first stacked semiconductor device and the second semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.