Patent · US Active

Die-die stacking

US9806067B2 · kind B2 · utility

0Cited by

0References

8Claims

0Family size

Assignee

GlobalFoundries Inc. · KY

Inventors

Sven Beyer · Dresden, DE
Jan Hoentschel · Dresden, DE
Alexander Ebermann · Dresden, DE

Key dates

Filing date	Jul 20, 2015
Grant date	Oct 31, 2017
Priority date	—
Expiry date	Jul 20, 2035

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/12044
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor die is provided with an optical transmitter configured to transmit an optical signal to another die and an optical receiver configured to receive an optical signal from another die. Furthermore, a method of forming a semiconductor device is provided including forming a first semiconductor die with the steps of providing a semiconductor substrate, forming a transistor device at least partially over the semiconductor substrate, forming an optical receiver one of at least partially over and at least partially in the semiconductor substrate, forming a metallization layer over the transistor device, and forming an optical transmitter one of at least partially over the metallization layer and at least partially in the metallization layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.