Visible and infrared image sensor

US9806122B2 · kind B2 · utility

Assignee

• OmniVision Technologies, Inc. · US

Inventors

• Eric A. G. Webster · Mountain View, US
• Howard E. Rhodes · Boise, US
• Dominic Massetti · San Jose, US

Key dates

• Filing date: Jul 25, 2014
• Grant date: Oct 31, 2017
• Expiry date: Aug 9, 2035

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10F77/122

Abstract

A pixel array including an SixGey layer disposed on a first semiconductor layer. A plurality of pixels is disposed in the first semiconductor layer. The plurality of pixels includes: (1) a first portion of pixels separated from the SixGey layer by a spacer region and (2) a second portion of pixels including a first doped region in contact with the SixGey layer. The pixel array also includes pinning wells disposed between individual pixels in the plurality of pixels. A first portion of the pinning wells extend through the first semiconductor layer. A second portion of the pinning wells extend through the first semiconductor layer and the SixGey layer.