Interposers for integrated circuits with multiple-time programming and methods for manufacturing the same
US9806128B2 · kind B2 · utility
1Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 22, 2015 |
| Grant date | Oct 31, 2017 |
| Priority date | — |
| Expiry date | May 22, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
Abstract
An interposer for an integrated circuit includes a first side and a second side. The interposer includes a substrate and a via disposed in the substrate. A first electrical contact is disposed on the first side. A second electrical contact is disposed on the second side and electrically connected to the via. The interposer also includes a multiple-time programmable (“MTP”) element electrically connected to the first electrical contact and/or the via.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.