Antenna-in-package structures with broadside and end-fire radiations
US9806422B2 · kind B2 · utility
31Cited by
15References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 10, 2014 |
| Grant date | Oct 31, 2017 |
| Priority date | — |
| Expiry date | Oct 20, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Package structures are provided having antenna-in-packages that are integrated with semiconductor RFIC (radio frequency integrated circuit) chips to form compact integrated radio/wireless communications systems that operate in the millimeter wave (mmWave) frequency range with radiation in broadside and end-fire directions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.