Method of mounting electronic component to circuit board
US9807889B2 · kind B2 · utility
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2References
2Claims
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Key dates
| Filing date | Jul 29, 2013 |
| Grant date | Oct 31, 2017 |
| Priority date | — |
| Expiry date | Oct 12, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An method of mounting electronic component includes: providing a connecting layer between a wiring and an electronic component, the connecting layer including a conductive layer formed of a solder powder-containing resin composition containing thermosetting resin, solder powder, and a reducing agent and one or two layers of a thermoplastic resin layer formed of thermoplastic resin; and electrically connecting the electronic component to the wiring through the connecting layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.