Methods of fabricating low melting point solder reinforced sealant and structures formed thereby
US9808875B2 · kind B2 · utility
0Cited by
21References
8Claims
0Family size
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Key dates
| Filing date | Feb 5, 2016 |
| Grant date | Nov 7, 2017 |
| Priority date | — |
| Expiry date | Feb 5, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12222
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Methods and associated structures of forming a package structure including forming a low melting point solder material on a solder resist opening location of an IHS keep out zone, forming a sealant in a non SRO keep out zone region; attaching the IHS to the sealant, and curing the sealant, wherein a solder joint is formed between the IHS and the low melting point solder material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.