Indium electroplating compositions containing 1,10-phenanthroline compounds and methods of electroplating indium
US9809892B1 · kind B1 · utility
1Cited by
6References
6Claims
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Key dates
| Filing date | Jul 18, 2016 |
| Grant date | Nov 7, 2017 |
| Priority date | — |
| Expiry date | Jul 18, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D5/022
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Iridium electroplating compositions containing 1,10-phenanthroline compounds in trace amounts to electroplate substantially defect-free uniform and smooth surface morphology indium on metal layers. The indium electroplating compositions can be used to electroplate indium metal on metal layers of various substrates such as semiconductor wafers and as thermal interface materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.