Semiconductor wafer device and manufacturing method thereof
US9812346B2 · kind B2 · utility
1Cited by
1References
20Claims
0Family size
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Key dates
| Filing date | Dec 14, 2015 |
| Grant date | Nov 7, 2017 |
| Priority date | — |
| Expiry date | Dec 14, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P80/30
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of manufacturing a semiconductor device comprises providing a carrier, disposing a plurality of dies over the carrier along a first direction and a second direction orthogonal to the first direction to arrange the plurality of dies in a plurality of rows, and shifting one of the plurality of rows along the first direction or the second direction in a predetermined distance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.