Composite substrate with alternating pattern of diamond and metal or metal alloy
US9812375B2 · kind B2 · utility
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2References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 1, 2016 |
| Grant date | Nov 7, 2017 |
| Priority date | — |
| Expiry date | Feb 1, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8582
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A composite substrate includes a submount substrate of an alternating pattern of electrically insulative portions, pieces, layers or segments and electrically conductive portions, pieces, layers or segments, and a shaft, back or plate for supporting the alternating pattern of electrically insulative portions and electrically conductive portions. An active device having a P-N junction can be mounted on the submount substrate. The electrically insulative portions, pieces, layers or segments can be formed from diamond while the electrically conductive portions, pieces, layers or segments can be formed from a metal or metal alloy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.