Substrate processing apparatus, method for manufacturing semiconductor device, and recording medium
US9816182B2 · kind B2 · utility
3Cited by
27References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 29, 2015 |
| Grant date | Nov 14, 2017 |
| Priority date | — |
| Expiry date | Jan 29, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67248
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate processing apparatus is disclosed. The substrate processing apparatus includes a process chamber configured to accommodate a substrate; a gas supply unit configured to supply a process gas into the process chamber; a lid member configured to block an end portion opening of the process chamber; an end portion heating unit installed around a side wall of an end portion of the process chamber; and a thermal conductor installed on a surface of the lid member in an inner side of the process chamber, and configured to be heated by the end portion heating unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.