Integrated chuck
US9817208B1 · kind B1 · utility
0Cited by
13References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2016 |
| Grant date | Nov 14, 2017 |
| Priority date | — |
| Expiry date | Sep 20, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/2826
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A chuck interface that includes a mirror; an inner surface that is shaped and sized to match a portion of a sidewall of a chuck; wherein the inner surface is mechanically coupled to the mirror; and at least one interfacing element for assisting in attaching the chuck to the mirror; and wherein a difference between a thermal expansion coefficient of the chuck and a thermal expansion coefficient of the mirror does not exceed 0.5 micron*Kelvin per Meter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.