Patent · US Active

Semiconductor package assembly with passive device

US9818727B2 · kind B2 · utility

1Cited by

2References

38Claims

0Family size

Assignee

MEDIATEK INC. · TW

Inventors

Che-Hung Kuo · Hsinchu, TW
Ying-Chih Chen · Danei, TW
Che-Ya Chou

Key dates

Filing date	Feb 1, 2016
Grant date	Nov 14, 2017
Priority date	—
Expiry date	Feb 1, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19107
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The invention provides a semiconductor package assembly. The semiconductor package assembly includes a first substrate. A first semiconductor die is disposed on the first substrate. A passive device is located directly on the first semiconductor die. The passive device is disposed within a boundary of the first semiconductor die in a plan view.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.