Fault tolerant design for large area nitride semiconductor devices
US9818857B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 28, 2014 |
| Grant date | Nov 14, 2017 |
| Priority date | — |
| Expiry date | Oct 28, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/411
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A fault tolerant design for large area nitride semiconductor devices is provided, which facilitates testing and isolation of defective areas. A transistor comprises an array of a plurality of islands, each island comprising an active region, source and drain electrodes, and a gate electrode. Electrodes of each island are electrically isolated from electrodes of neighboring islands in at least one direction of the array. Source, drain and gate contact pads are provided to enable electrical testing of each island. After electrical testing of islands to identify defective islands, overlying electrical connections are formed to interconnect source electrodes in parallel, drain electrodes in parallel, and to interconnect gate electrodes to form a common gate electrode of large gate width Wg. Interconnections are provided selectively to good islands, while electrically isolating defective islands. This approach makes it economically feasible to fabricate large area GaN devices, including hybrid devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.