High Tg epoxy formulation with good thermal properties
US9822227B2 · kind B2 · utility
2Cited by
5References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 18, 2015 |
| Grant date | Nov 21, 2017 |
| Priority date | — |
| Expiry date | Jun 18, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0373
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Varnish compositions and prepregs and laminates made therefrom wherein the varnish compositions include at least one first epoxy resin and at least one second epoxy resin that includes a bisphenol-A novolac epoxy resin and a harder wherein the at least one first epoxy resin and the at least one second bisphenol-A novolac epoxy resin are present in the varnish at a weight ratio ranging from about 1:1 to about 1:3.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.