David Bedner
6Patents
2h-index
6Co-inventors
40Inventor score
Filing activity: Nov 8, 2005 → Jan 31, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9822227B2 | High Tg epoxy formulation with good thermal properties | Electricity | 2 | Active |
| US8129456B2 | Flame retardant compositions with a phosphorated compound | Electricity | 2 | Active |
| US10364332B2 | High Tg epoxy formulation with good thermal properties | Electricity | 1 | Active |
| US11581239B2 | Lead-free solder paste as thermal interface material | Electricity | 0 | Active |
| US8697864B2 | Flame retardant compositions with a phosphorated compound | Electricity | 0 | Active |
| US11155687B2 | High Tg epoxy formulation with good thermal properties | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.