X-ray surface analysis and measurement apparatus
US9823203B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 3, 2016 |
| Grant date | Nov 21, 2017 |
| Priority date | — |
| Expiry date | Mar 3, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2235/086
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Systems for x-ray diffraction/scattering measurements having greater x-ray flux and x-ray flux density are disclosed. These are useful for applications such as material structural analysis and crystallography. The higher flux is achieved by using designs for x-ray targets comprising a number of microstructures of one or more selected x-ray generating materials fabricated in close thermal contact with a substrate having high thermal conductivity. This allows for bombardment of the targets with higher electron density or higher energy electrons, which leads to greater x-ray flux. The high brightness/high flux source may then be coupled to an x-ray reflecting optical system, which can focus the high flux x-rays to a spots that can be as small as one micron, leading to high flux density, and used to illuminate materials for the analysis based on their scattering/diffractive effects.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.