Lithography alignment marks
US9823574B2 · kind B2 · utility
2Cited by
9References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2015 |
| Grant date | Nov 21, 2017 |
| Priority date | — |
| Expiry date | Sep 29, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/975
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A device for semiconductor fabrication includes a substrate and a layer formed over the substrate, wherein the layer includes an alignment mark. The alignment mark includes a first plurality of elongated members that are oriented lengthwise along a first direction and are distributed along a second direction. The alignment mark further includes a second plurality of elongated members that are oriented lengthwise along a third direction perpendicular to the first direction and are distributed along the second direction, wherein the second direction is different from each of the first and third directions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.