Patent · US Active

Chuck, in particular for use in a mask aligner

US9824909B2 · kind B2 · utility

0Cited by

8References

16Claims

0Family size

Assignee

SUSS MICROTEC LITHOGRAPHY GMBH · DE

Inventors

Sven Hansen · Hamburg, DE
Thomas Huelsmann · Garching bei München, DE
Katrin SCHINDLER · Garching an der Alz, DE

Key dates

Filing date	Dec 4, 2013
Grant date	Nov 21, 2017
Priority date	—
Expiry date	Dec 4, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/6833
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A chuck for aligning a first planar substrate in parallel to a second planar substrate includes a top plate having a top surface for arrangement of the first planar substrate. A bottom plate is at least one distance measuring sensor configured to measure a distance between the top surface of the top plate and a surface of the second planar substrate, and at least three linear actuators in contact with the top plate and the bottom plate. The method for setting a gap between the first and second planar substrate includes measuring the thickness of the first planar substrate and measuring between a surface of the second planar substrate and the top surface of the top plate. The tilt adjusts between a top surface of the first planar substrate or the chuck and the surface of the second planar substrate by using at least three linear actuators of the chuck.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.