Polishing pad and preparing method thereof
US9827646B2 · kind B2 · utility
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1References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 19, 2016 |
| Grant date | Nov 28, 2017 |
| Priority date | — |
| Expiry date | May 19, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/24
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present disclosure relates to a porous polishing pad including pores by carbon dioxide gas generated by a reaction between a prepolymer and a hydrophilic polymer, and a method of preparing the porous polishing pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.