Polyimides as laser release materials for 3-D IC applications
US9827740B2 · kind B2 · utility
4Cited by
12References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 22, 2015 |
| Grant date | Nov 28, 2017 |
| Priority date | — |
| Expiry date | Dec 29, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1917
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The invention broadly relates to release layer compositions that enable thin wafer handling during microelectronics manufacturing. Preferred release layers are formed from compositions comprising a polyamic acid or polyimide dissolved or dispersed in a solvent system, followed by curing and/or solvent removal at about 250° C. to about 350° C. for less than about 10 minutes, yielding a thin film. This process forms the release compositions into polyimide release layers that can be used in temporary bonding processes, and laser debonded after the desired processing has been carried out.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.