Separation apparatus, separation system, and separation method
US9827756B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 16, 2012 |
| Grant date | Nov 28, 2017 |
| Priority date | — |
| Expiry date | Mar 16, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1972
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A separation apparatus for separating a superposed substrate in which a processing target substrate and a supporting substrate are joined together with an adhesive, into the processing target substrate and the supporting substrate includes: a first holding unit that includes a heating mechanism heating the processing target substrate and holds the processing target substrate; a second holding unit that includes a heating mechanism heating the supporting substrate and holds the supporting substrate; a moving mechanism that relatively moves at least the first holding unit or the second holding unit in a horizontal direction; and a porous part that is annularly provided along an outer peripheral portion of the first holding unit and formed with a plurality of pores, and supplies an inert gas to the outer peripheral portion of the first holding unit holding the processing target substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.