Cleaning composition and method for cleaning semiconductor wafers after CMP
US9828574B2 · kind B2 · utility
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1References
19Claims
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Assignee
Inventors
Key dates
| Filing date | Jan 12, 2016 |
| Grant date | Nov 28, 2017 |
| Priority date | — |
| Expiry date | Apr 3, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The invention provides a composition for cleaning contaminants from semiconductor wafers following chemical-mechanical polishing. The cleaning composition contains one or more quaternary ammonium hydroxides, one or more organic amines, one or more metal inhibitors, and water. The invention also provides methods for using the cleaning composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.