Probe guide plate and semiconductor inspection apparatus
US9829509B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 2, 2014 |
| Grant date | Nov 28, 2017 |
| Priority date | — |
| Expiry date | Aug 26, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/07314
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A probe guide plate used for a semiconductor inspection apparatus that inputs and outputs an electrical signal for inspecting an object via a probe needle, the probe guide plate includes a silicon substrate provided with a through hole that penetrates the silicon substrate from one surface to another surface through which the probe needle is inserted, the through hole including a first tapered portion provided at an end portion at the one surface side such that the hole size of which increases as it approaches the one surface, and a second tapered portion provided at an end portion at the other surface side such that the hole size of which increases as it approaches the other surface; and a silicon oxide film formed on an inner wall surface of the through hole including the first tapered portion and the second tapered portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.