Hybrid-integrated multi-chip module
US9829626B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 13, 2016 |
| Grant date | Nov 28, 2017 |
| Priority date | — |
| Expiry date | Mar 20, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B2006/12147
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A multi-chip module (MCM) is described. This MCM includes a driver integrated circuit that includes electrical circuits, a photonic chip, an interposer, and an optical gain chip. The photonic chip may be implemented using a silicon-on-insulator technology, and may include an optical waveguide that conveys an optical signal and traces that are electrically coupled to the driver integrated circuit. Moreover, the interposer may be electrically coupled to the traces. Furthermore, the optical gain chip may include a III/V compound semiconductor (and, more generally, a semiconductor other than silicon), and may include a second optical waveguide that conveys the optical signal and that is vertically aligned with the optical waveguide relative to a top surface of the interposer. Additionally, the optical gain chip may be electrically coupled to the interposer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.