Method for treating substrate
US9831081B2 · kind B2 · utility
2Cited by
6References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 8, 2016 |
| Grant date | Nov 28, 2017 |
| Priority date | — |
| Expiry date | Jun 8, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02041
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In embodiment, the method includes cleaning a preceding substrate, and drying the preceding substrate and cleaning a next substrate. Drying the preceding substrate and cleaning the next substrate include determining a cleaning start time of the next substrate, and the cleaning start time corresponds to a desired time point after starting drying the preceding substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.