Capacitors with barrier dielectric layers, and methods of formation thereof
US9831171B2 · kind B2 · utility
3Cited by
6References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 12, 2014 |
| Grant date | Nov 28, 2017 |
| Priority date | — |
| Expiry date | Nov 12, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device including a first metal feature is disposed in a first insulating layer. A second metal feature is disposed in a second insulating layer and separated from the first metal feature by a portion of a first etch stop liner disposed between the first and the second insulating layers. The second metal feature is capacitively coupled to the first metal feature through the first etch stop liner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.