Semiconductor devices with solder-based connection terminals and method of forming the same
US9831202B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 12, 2016 |
| Grant date | Nov 28, 2017 |
| Priority date | — |
| Expiry date | Sep 12, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/07025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device is provided, which includes a substrate having an electrically conductive contact pad thereon and an electrically conductive connection terminal on the contact pad. The connection terminal includes an electrically conductive pillar structure and a solder layer that extends on the pillar structure and contacts a protruding portion of a sidewall of the pillar structure. The pillar structure can include a lower pillar layer, a diffusion barrier layer on the lower pillar layer and an upper pillar layer on the diffusion barrier layer. In some additional embodiments of the invention, the protruding portion of the sidewall of the pillar structure includes an outermost portion of an upper surface of the diffusion barrier layer. This can be achieved by making a width of the diffusion barrier layer greater than a width of the upper pillar layer when viewed in transverse cross-section.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.