Package substrate machining method
US9831381B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 26, 2016 |
| Grant date | Nov 28, 2017 |
| Priority date | — |
| Expiry date | Aug 26, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0362
Abstract
A package substrate machining method is provided. The package substrate includes a ceramic substrate, a plurality of device chips arranged on one face of the ceramic substrate, and a coating layer made of a resin that covers the entire one face of the ceramic substrate. The package substrate machining method includes a first laser-machined groove formation step adapted to form, in the coating layer, first laser-machined grooves along scheduled division lines set up on the package substrate by irradiating a laser beam at a wavelength absorbable by the coating layer from the coating layer side of the package substrate; and a second laser-machined groove formation step adapted to form, in the ceramic substrate and after the first laser-machined groove formation step, second laser-machined grooves along the scheduled division lines by irradiating a laser beam from the ceramic substrate side of the package substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.