Methods and devices for providing increased routing flexibility in multi-layer printed circuit boards
US9832865B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2016 |
| Grant date | Nov 28, 2017 |
| Priority date | — |
| Expiry date | Apr 26, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/107
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A build-up process for fabricating a multi-layer PCB is provided during which a mezzanine redistribution, or routing, structure is formed within one of the PCB dielectric material layers that allows additional electrical interconnections (i.e., traces and crossovers) to be made within that layer, thereby obviating the need to add an additional PCB layer in order to make those interconnections. The mezzanine redistribution structure also can be interconnected with the metal layers that are above and below it to further increase routing complexity and flexibility. The mezzanine redistribution structure can be formed without increasing the total thickness of the PCB and without substantially increasing costs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.