Microelectronic device package electromagnetic shield

US9836095B1 · kind B1 · utility

Assignee

• Intel Corporation · US

Inventors

• Min Suet Lim · Kampung Bukit Kechil, MY
• Eng Huat Goh · Air Itam, MY
• Khang Choong Yong · Puchong, MY
• Boon Ping Koh · Permatang Janggus, MY
• Wil Choon Song · Bayan Lepas, MY

Key dates

• Filing date: Sep 30, 2016
• Grant date: Dec 5, 2017
• Expiry date: Sep 30, 2036

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/3025
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Microelectronic devices including an electromagnetic shield over a desired portion of a substrate. The magnetic shield is formed of conductive particles within a selectively curable layer, such as a solder resist material. After application to the substrate, the conductive particles are allowed to settle to form a conductive structure to serve as an electromagnetic shield. The electromagnetic shield can be formed primarily over regions of the substrate containing conductive traces coupled in the package to communicate signals presenting a risk of causing electromagnetic interference with other devices.